Hot press is also known as the state machine. According to the thermal medium is different, can be divided into soldering, ACF, guide electrical tape), ACP, guide electricity glue), TBF (hot melt adhesive film). Apply to the FPC (flexible circuit board), HSC (the paper), the TAB with LCD and PCB connection. Due to the PCB in the consumer electronics or FPC Pitch tend to be small, traditional soldering technology has been difficult to meet the requirements of very fine hot pressing. ACF process has gradually be used in mobile phone design.